FlipChip International Announces Agreement to Acquire Assets of IC Services

FlipChip International Announces Agreement to Acquire Assets of IC Services

PHOENIX, Dec. 8 /PRNewswire/ -- FlipChip International today announced an agreement to acquire substantially all of the assets of IC Services, Inc. IC Services is a leading supplier of merchant semiconductor services since its inception in 1994, whose assets include substantial dicing, automated inspection, backgrind and tape/reel capabilities. FlipChip International intends to integrate the assets into its wafer level packaging and wafer bumping services portfolio upon completion of the acquisition, which is expected to be completed by December 31, 2004.

Commenting on the agreement, Bob Forcier, President and CEO of FlipChip International, said, "We are very pleased to expand our technology investments with the proposed IC Services acquisition. The ability to provide dicing, tape and reel, and in-house backgrinding capability to our customers is part of our five-year roadmap for full services."

Mr. Bruce Bowers, Vice President of FlipChip International added, "We are excited about the addition of IC Services' offerings to our current wafer bumping processing. This extends the turn key concept for wafer to die processing for our customers." Mr. Bowers will be the General Manager of the IC Services product line within FlipChip International after the completion of the acquisition.

Mr. John Koch, Chief Executive Officer of IC Services, said, "We are fortunate to have developed a strong relationship with FlipChip International and we see great synergy with their business in the area of rapid response back-end services. We are very pleased that FlipChip International and IC Services have entered into this agreement."

FlipChip International, LLC is a privately-held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. Flip Chip International, LLC is a wholly owned subsidiary of RoseStreet Labs LLC, a supplier of products and services for wireless infrastructure in the life science, renewable energy and homeland security markets.

For further information contact:
Stephanie Perry
FlipChip International, LLC
602-431-4747
stephanie.perry@flipchip.com
website: www.flipchip.com



Source: FlipChip International, LLC

CONTACT: Stephanie Perry of FlipChip International, LLC,
+1-602-431-4747, stephanie.perry@flipchip.com

Web site: http://www.flipchip.com/


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